HYAMP® Ground Bond Tester
Compact in Size, Completes Your Safety
The HYAMP® 3240 ( formerly known as eec EGB-300 ) is AR’s next-generation ground bond (GB) tester brings together AC and DC testing capability in a compact size design. Offering a maximum 40A current measurement capability and high-accuracy performance, the HYAMP® 3240 embodies AR’s commitment on delivering high quality products to customers.It is the ideal solution for electrical hardware tests, ranging from home appliances to audio/video equipment. Despite its compact design, the HYAMP® 3240 does not come up short on adaptability. Interlink to an HYAMP® 3240 hipot tester for a 5-in-1 testing system. Which can be conveniently mounted in a 2U rack to create a complete ACW, DCW, IR, AC GB, and DC GB testing solution.
Hipot Ground Bond test
HYAMP®
Ground Bond Testing made easy. Verify the integrity of your product’s ground circuitry with the New HYAMP Ground Bond Tester. From start to finish, Ground Bond Testing has never been more efficient, with on-board data storage, convenient front panel USB data collection, and front panel barcode connection capabilities. We’ve included AC and DC current capabilities within one Ground Bond Tester to improve testing flexibility. Interconnect the HYAMP Series with the Hypot® Series to form a complete safety compliance system and maximize your workstation.
